Senior Staff Engineer Methodology and Software for Chip Package Board Co-Design
vor 2 Monaten
As a Senior Staff Engineer, you will play a key role in driving the creation and rollout of design methodologies and flows to optimize Chip, Package, Board Design tools and processes.
Key Responsibilities:- Drive Design Methodologies and Flows: Develop and implement design methodologies and flows to optimize Chip, Package, Board Design tools and processes.
- Collaborate with Cross-Functional Teams: Collaborate with R&D, EDA vendors, and IT teams to streamline tool integration and address software and methodology challenges.
- Stay Up-to-Date with Industry Trends: Keep a close watch on EDA and software trends to maintain our leading edge in tools and innovation.
- Deliver Training and Support: Deliver targeted training and support for new methodologies and tools, fostering a culture of learning and efficiency.
- Build Strong Relationships: Develop strong relationships with stakeholders, effectively translating and communicating the benefits of new tool features and methodologies.
- Coordinate Software Projects: Coordinate and align software projects with engineering principles, focusing on tool automation and enhancements.
- Lead by Example: Guide the team in adopting software best practices, from code reviews to build and test operations.
- Education: University degree in Electrical-, Microelectronic Engineering or Computer Science.
- Experience: Strong background in EDA/PLM methodology with proven experience in design flow development and CAD project execution.
- Technical Skills: Experience with Cadence, Synopsys or Siemens EDA tools, knowledge of IC driven package technologies, software programming and scripting skills, including modern software engineering practices like version control, continuous integration and automated testing frameworks.
- Leadership and Communication Skills: Experience in technical leadership and project management, excellent verbal and written communication skills in English.
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Villach, Kärnten, Österreich Infineon Technologies VollzeitJob Title: Senior Staff Engineer Methodology and Software for Chip Package Board Co-DesignWe are seeking a highly skilled Senior Staff Engineer to join our Chip Package Board Co-Design team. As a key member of our team, you will be responsible for driving the creation and rollout of design methodologies and flows to optimize Chip, Package, Board Design tools...
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Villach, Kärnten, Österreich Infineon Technologies VollzeitJob Title: Senior Staff Engineer Methodology and Software for Chip Package Board Co-DesignWe are seeking a highly skilled Senior Staff Engineer to join our Chip Package Board Co-Design team. As a key member of our team, you will play a strategic role in developing design methodologies and software solutions that drive innovation and excellence in our...
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Villach, Kärnten, Österreich Infineon Technologies VollzeitJob Title: Senior Staff Engineer Methodology and Software for Chip Package Board Co-DesignAt Infineon Technologies, we are seeking a highly skilled Senior Staff Engineer to join our Design Enabling and Services (DES) team. As a key member of our organization, you will be responsible for driving the creation and rollout of design methodologies and flows to...
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Villach, Kärnten, Österreich Infineon Technologies VollzeitJob Title: Senior Staff Engineer Methodology and Software for Chip Package Board Co-DesignAt Infineon Technologies, we are seeking a highly skilled Senior Staff Engineer to join our Design Enabling and Services (DES) team. As a key member of our organization, you will be responsible for driving the creation and rollout of design methodologies and flows to...
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Villach, Kärnten, Österreich Infineon Technologies VollzeitJob Title: Senior Staff Engineer Methodology and Software for Chip Package Board Co-DesignAt Infineon Technologies, we are seeking a highly skilled Senior Staff Engineer to join our team in Villach, Austria. As a Senior Staff Engineer, you will play a key role in driving the creation and rollout of design methodologies and flows to optimize Chip, Package,...
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Villach, Kärnten, Österreich Infineon Technologies VollzeitJob Title: Senior Staff Engineer Methodology and Software for Chip Package Board Co-DesignWe are seeking a highly skilled Senior Staff Engineer to join our team at Infineon Technologies in Villach, Austria. As a Senior Staff Engineer, you will be responsible for driving the creation and rollout of design methodologies and flows to optimize Chip, Package,...
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Villach, Kärnten, Österreich Infineon Technologies VollzeitJob DescriptionAs a Senior Staff Engineer Methodology and Software for Chip Package Board Co-Design, you will play a key role in driving the creation and rollout of design methodologies and flows to optimize Chip, Package, Board Design tools and processes. You will collaborate between R&D, EDA vendors, and IT, streamlining tool integration and addressing...
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Villach, Kärnten, Österreich Infineon Technologies VollzeitJob Title: Senior Staff Engineer Methodology and Software for Chip Package Board Co-DesignAt Infineon Technologies, we are seeking a highly skilled Senior Staff Engineer to join our team in Villach, Austria. As a key member of our Design Enabling and Services (DES) organization, you will play a critical role in shaping the technologies of tomorrow.Key...
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Villach, Kärnten, Österreich Infineon Technologies VollzeitJob DescriptionYou want to play a key role in the development of design methodologies and software solutions within our Chip Package Board Co-Design team? As a Senior Staff Engineer, you will be at the forefront of enhancing our design flows while contributing significantly to software development projects.Key ResponsibilitiesDrive the creation and rollout...
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Villach, Kärnten, Österreich Infineon Technologies VollzeitJob DescriptionAs a Senior Staff Engineer, you will play a key role in driving the creation and rollout of design methodologies and flows to optimize Chip, Package, Board Design tools and processes.Key Responsibilities:Drive Design Methodologies and Flows: Develop and implement design methodologies and flows to optimize Chip, Package, Board Design tools and...
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