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Senior Staff Engineer Methodology and Software for Chip Package Board Co-design

vor 2 Monaten


Villach, Kärnten, Österreich Infineon Technologies Vollzeit
Job Description

In this role, you will be responsible for driving the development and implementation of design methodologies and flows to optimize Chip, Package, Board Design tools and processes.

Key Responsibilities:
  • Collaborate with R&D, EDA vendors, and IT teams to streamline tool integration and address software and methodology challenges.
  • Stay up-to-date with EDA and software trends to maintain Infineon's leading edge in tools and innovation.
  • Deliver targeted training and support for new methodologies and tools, fostering a culture of learning and efficiency.
  • Develop strong relationships with stakeholders, effectively communicating the benefits of new tool features and methodologies.
  • Coordinate and align software projects with engineering principles, focusing on tool automation and enhancements.
  • Guide the team in adopting software best practices, from code reviews to build and test operations.
Requirements:
  • University degree in Electrical-, Microelectronic Engineering or Computer Science.
  • Strong background in EDA/PLM methodology with proven experience in design flow development and CAD project execution.
  • Experience with Cadence, Synopsys or Siemens EDA tools.
  • Knowledge of IC driven package technologies.
  • Software programming and scripting skills, including modern software engineering practices like version control, continuous integration and automated testing frameworks.
  • Experience in technical leadership and project management is an asset.
  • Excellent verbal and written communication skills in English.