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Master Thesis: Transmission Electron Microscopy of

vor 1 Monat


Villach, Österreich Infineon Technologies Vollzeit

This thesis will focus on the characterization of the interface between
**SiC **and
**TiAl3 **by
**transmission electron microscopy (TEM) **. The following tasks are involved during the course of this work:

- Sample preparation for TEM via focused ion beam (FIB)
- Characterization of TiAl3/SiC heterostructures by TEM
- Process analysis in collaboration with technology experts

**Further Information**
Type of employment: Full-time (Flexible working hours from Monday to Friday between 6 a.m. and 7 p.m.)

Duration: min. 12 months

**This thesis has to be written in cooperation with an university.**

You are best equipped for this task if you have:

- A Bachelor’s degree in **Physics **, **Mechanical Engineerin **g, **Material Science **or similar and are a motivated and committed **Master's student **from that field of studies
- Theoretical knowledge on **material characterization **, **semiconductor physics **and **chemistry**:

- First experience in **microscopy **is a plus
- Fluency in **English **, German is a plus
- Motivation letter
- CV
- Certificate of matriculation at a university (you must be enrolled and not on academic leave)
- Latest Transcript of records (not older than 6 months)
- Highest completed educational certificate (Matura certificate for Bachelor students, Bachelor certificate for Master students)
- Reference letter (optional)

More than 5.000 people work at five different sites in Austria.

**Part of your life. Part of tomorrow.**

Infineon is a world leader in semiconductor solutions that make life easier, safer, and greener. Our solutions for efficient energy management, smart mobility, and secure, seamless communications link the real and the digital world.

The
**Frontend (FE) **cluster offers a broad range of manufacturing competence specialized in high-quality logic products. The portfolio represents Power, Bipolar, Sensor, Passive and Diode technologies as well as CMOS, RF-CMOS and embedded flash technologies. The manufacturing sites in Dresden, Kulim, Regensburg and Villach are committed to Operational Excellence with strong customer focus.

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