RF Design Manager

Vor 3 Tagen


Council of the City of Sydney, Österreich Morse Micro Vollzeit

RF Design Manager Join Morse Micro as an experienced RF Design Manager to play a key role in building next‑generation Wi‑Fi chips that enable the Internet of Things. Overview Morse Micro is at the forefront of next‑generation Wi‑Fi technology, delivering breakthrough solutions that redefine wireless connectivity. Our innovative products meet the demands of the rapidly evolving market, providing superior performance and reliability. Main Duties & Responsibilities Reporting to the VP of ASIC Engineering & Product, you will lead the Radio team including design, development and verification of Morse Micro’s wireless ICs. You will be responsible for ensuring that staffing, infrastructure, and processes drive silicon development from design through to tapeout, delivering high‑quality, reliable results every time. In this role, you will work closely with teams across the company throughout the design, development, and production phases, supporting silicon bring‑up and product delivery. Your leadership will be key to enabling customer success and ensuring our silicon meets performance, reliability, and time‑to‑market goals. Required Skills & Experience Ability to deliver complex projects with large unknown/new components on time Demonstrated technical project management skills of cross‑functional teams Demonstrated technical leadership within the team Mentorship & guidance of junior team members Sound working knowledge of adjacent technical specialities Extensive knowledge of wider implications of technology and product development including understanding the competitive market landscape (e.g. area, power consumption of competitive parts, FOM for state of the art circuits) Effectively leads the design, development and implementation of strategic technical initiatives which contribute to the future growth and success of Morse Micro Comprehensive knowledge and understanding of status and issues across all engineering groups, inc. IP landscape and production engineering Overseeing chip bring up on bench Defining and leadership of chip qualification and product engineering Leading the de‑bug of chip functional and performance problems Interpreting and analyzing the validation of simulation results against systems design Interpreting and analyzing the validation of bench measurements against systems design 15+ years experience leading cross‑functional teams in a similar role 15+ years experience in the wireless domain MSc or PhD in Electrical / Electronics / Communication Engineering Experience taking wireless chips to mass production A deep understanding of CMOS transistor operation Experience with TSMC 40nm and 22nm processes Expert with IC design flows from Cadence or Synopsys Familiarity with a GNU/Linux development environment Familiarity with the IEEE 802.11 standard Familiarity with analog modelling languages such as veriloga Familiarity with Matlab/Octave Experience with bringing up complex mixed‑signal chips in a lab environment Excellent verbal and written communication skills Strong analytical and problem‑solving skills What We Offer Competitive salary + excellent stock option package Performance Bonus opportunity Income protection Insurance Healthy work environment with sit/stand desks and large screens Lots of snacks & drinks, including barista coffee, Friday team lunches & some of the world’s best beers Work from home policy Community & social groups and much more Join a high performing, inclusive company where you can make a real impact Who We Are Morse Micro is Australia’s largest semiconductor company building Wi‑Fi HaLow (802.11ah) chips for the Internet of Things (IoT). We are a team of wireless experts that love to work hard, innovate, and invent. Together, we are building the world’s lowest power Wi‑Fi technology that will enable billions of IoT devices to connect securely to the internet. We are a global team with offices in Sydney & Picton (Australia), Irvine, Bay Area & Boston (USA), Bangalore (India), Cambridge (UK), Hangzhou (China), Taipei (Taiwan) and Tokyo (Japan). #J-18808-Ljbffr



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